500mm/min Electronic Tape Peeling Testing Machine Adhesive Adhesion Test Instrument

Adhesive Adhesion Test Instrument Tape Peeling Testing Machine

Uses:

This machine is designed for quick and reliable tensile, compression, bending, shear, peel, loop tack and fatigue cycling on metals, tape, composites, alloys, rigid plastics and films, elastomers, textiles, paper, board and finished products.

Design standard:

ASTM D903, GB/T2790/2791/2792, CNS11888, JIS K6854, PSTC7

Character:

1 That Using the computer as the main control mathine plus the special testing software of our campany can conduct all of testing parameter, work state, collecting data&analysis, result display and printing output.

2 Have steady performace, high accuracy, powerful software function and easy operation.

3 Use the USA high-precision load cell.

Specifications:

Guangdong KeJian Testing Instrument co., LTD., founded in 2003, is a professional research and development, production of precision testing instruments and provides a complete set of test solution technology enterprises, with professional factory equipment technology research and development team and excellent production, management level, continuously provide customers with satisfactory products and services, and gradually become the industry's leading supplier of instrumentation.

In line with the trend of market globalization, Kejian Instruments registered its wholly-owned subsidiary - Kejian Industrial Hong Kong Limited in 2009, and began to explore the international market and provide Kejian instruments products to overseas customers. So far, Kejian instruments has provided high-quality products and services to customers in more than 50 countries and regions around the world, many of which have become long-term partners because of their recognition and trust in Kejian instruments.

Based on the recognition of Kejian Instruments, The National Standards Drafting Committee invited us to participated in the drafting and revision of a number of national standards, and was invited to attend the adhesive industry summit forum for many times, sparing no effort to contribute to the development of national and industrial technologies.